Photo Credit: www.embedded-world.de
Germany’s embedded world exhibition and conference will make its India debut in Bengaluru from 17 to 19 November 2026, bringing an international programme on the hardware and software that power connected devices, industrial equipment and vehicles. NürnbergMesse Group’s Indian subsidiary, NuernbergMesse India Pvt. Ltd., will organise the event at the Bangalore International Exhibition Centre (BIEC).
The inaugural edition will run alongside Bengaluru Tech Summit 2026, organised by the Karnataka government’s Department of IT and Biotechnology. NuernbergMesse India said in its 3 November announcement that the two events would give industry leaders, engineers, developers and technology companies from India and overseas opportunities to meet across the electronics, semiconductor and wider technology sectors in one of India’s main centres for technology development and research.
India’s semiconductor design base
Sonia Prashar, Managing Director of NuernbergMesse India, linked the launch to India’s semiconductor design workforce and investments in manufacturing, chip design and advanced packaging.
“India’s semiconductor industry is entering a defining phase, with the market expected to grow from nearly US$64 billion in 2026 to US$200 billion by 2035. Government initiatives such as the India Semiconductor Mission, coupled with investments in manufacturing, design and advanced packaging, are accelerating this transformation. With nearly 20% of the world’s semiconductor design talent based in India, the country is well positioned to play a greater role in the global semiconductor value chain. The launch of embedded world India comes at an opportune time, providing a dedicated meeting point for global technology leaders and Indian innovators to exchange expertise, build partnerships and translate technological advancements into real-world applications.”
Hitesh Garg, Vice President and India Managing Director of NXP Semiconductors, pointed to the engineering demands of adding AI and connectivity to embedded systems.
“As AI and connectivity become integral to embedded systems, the need for secure, efficient and intelligent solutions continues to grow. India’s strong engineering talent and semiconductor design capabilities make it an important contributor to these advancements. embedded world India provides a valuable opportunity to engage with the developer community, share technical expertise and explore how emerging technologies can address real-world challenges across automotive, industrial and IoT applications.”
From embedded AI to vehicle software
An international programme committee led by Prof. Dr.-Ing. Axel Sikora will guide the multi-track technical conference. Prof. Sikora chairs the embedded world Conference and teaches at Offenburg University of Applied Sciences in Germany.
The programme will address emerging technologies and practical engineering challenges across five areas.
- Artificial intelligence and edge computing will cover embedded AI applications, computer vision, AI-assisted software development and energy-efficient AI that runs on or near devices.
- Safety and security will cover functional safety, secure embedded software, automotive safety architectures, AUTOSAR and post-quantum cryptography.
- IoT and connectivity will cover LoRaWAN, low-power wide-area networks (LPWAN), Bluetooth, sensor communication and next-generation connectivity standards.
- Hardware and systems engineering will cover RISC-V architectures, hardware–software co-design, real-time operating systems, hypervisors, testing and debugging.
- Automotive and intelligent mobility will cover advanced driver assistance systems, software-defined vehicles, automotive connectivity and next-generation mobility solutions.
The conference will include technical contributions from professionals at NXP Semiconductors, Infineon Technologies, STMicroelectronics, Siemens, Elektrobit, MathWorks, Green Hills Software, Silicon Labs, Semtech and Vector Informatik, among others.
Keynotes on physical AI and connected systems
Allan Frederiksen, Technology & Innovation Officer at Infineon Technologies, will deliver a keynote titled “Semiconductors. The Engine of Physical AI.” Mr Frederiksen will examine how advances in power, sensing, control, connectivity and security are enabling intelligent machines, autonomous systems and new generations of robots.
Maulin Patel, Senior Vice President of Engineering for Secure Connected Edge Processing at NXP Semiconductors, will speak on “From Connected Devices to Intelligent Systems: The Future of Embedded Technology”. N Venkatesh, Senior Director Engineering at Silicon Labs, will deliver a keynote titled “Next Generation Wi-Fi Networks – Addressing Intelligent Automation at Scale”.
Three-day exhibition to connect visitors with technology suppliers
Under an initiative the organisers call a “Community of Communities”, international technology alliances, industry associations and open-source projects will contribute dedicated technical sessions.
The three-day exhibition will cover embedded hardware and modules, semiconductor products, operating systems, AI applications, IoT platforms, development tools, testing technologies and engineering services. Visitors will be able to examine technologies, speak with providers and make business contacts across the exhibition and the concurrently held Bengaluru Tech Summit.
NuernbergMesse India, the local arm of the German exhibition group, organises specialised trade fairs and conferences that bring Indian and international companies together for business partnerships and exchanges on technology and industry practice.
For more information on the exhibition and technical conference, visit the official embedded world India website. For venue details and directions, visit the Bangalore International Exhibition Centre website.
