In a move reflecting the growing Indo-German collaboration in the semiconductor sector, Bosch Global Software Technologies (BGSW), the India-based arm of German technology giant Bosch, has signed a Memorandum of Understanding (MoU) with Chennai-headquartered fabless semiconductor firm Mindgrove Technologies. The agreement, signed on June 25, 2025, aims to jointly develop and deploy advanced chip solutions for diverse industries, signalling Germany’s deeper investment into India’s emerging chip design ecosystem.
Targeting Global and Domestic Markets
Under the agreement, Bosch and Mindgrove will explore joint market opportunities, integrating their products and solutions for customers spanning industrial automation, consumer electronics, automotive systems, and smart IoT infrastructure.
Following thorough technical assessments, BGSW plans to adopt Mindgrove’s System-on-Chip (SoC) offerings for its internal projects and promote these solutions among Bosch’s partners worldwide.
Field Deployments and Future Expansion
To validate the technology, Bosch intends to deploy Mindgrove’s SoCs in real-world field trials, aiming to pave the way for broader adoption across third-party applications. Mindgrove confirmed that once commercialisation milestones are achieved, the two firms will enter a long-term agreement to expand the deployment of these solutions into targeted sectors.
Co-Development of RISC-V Solutions
A significant aspect of the collaboration lies in co-developing SoCs based on the RISC-V instruction set architecture—a rising alternative to proprietary chip architectures. Mindgrove will design and develop chips and system reference designs with technical support from BGSW, which is working on tools such as compilers and software frameworks for RISC-V.
As part of this effort, Mindgrove will supply Bosch and its clients with chips and hardware boards for deployment, while offering end-to-end engineering and logistical support to ensure seamless development and validation. Performance data from these deployments will feed into future design improvements.
Industry Voices on Indo-German Collaboration
Yashwanth Singh M, Firmware & Silicon Architect at Bosch Global Software Technologies, said the partnership combines Bosch’s global R&D expertise with Mindgrove’s strength in designing cost-effective, high-performance chips tailored for both Indian and international markets.
“We are glad to collaborate with an indigenous chip design partner whose innovation roadmap aligns closely with practical industry requirements in India,” he noted.
Echoing the sentiment, Shashwath TR, Co-founder and CEO of Mindgrove Technologies, described the tie-up as a pivotal step towards creating innovation-led products built on advanced SoC platforms.
“By blending our chip design skills with Bosch’s extensive engineering experience, we aim to accelerate the roll-out of impactful solutions across critical domains,” he said.
Indo-German Synergies in Semiconductors
The Bosch-Mindgrove alliance reflects a broader trend of Indo-German cooperation in high-tech manufacturing and semiconductor innovation. As India strives to bolster its semiconductor ecosystem, such partnerships could play a crucial role in positioning the country as both a global design hub and a key node in the semiconductor value chain.